a process in which a solder paste (a sticky mixture of powdered solder and flux) is used to temporarily attach anywhere from one to thousands of tiny electrical components to their contact pads, after which the entire assembly is subjected to controlled heat.

the failure of blood to reperfuse an ischemic area after the physical obstruction has been removed or bypassed.

A reflow oven is a machine used primarily for reflow soldering of surface mount electronic components to printed circuit boards (PCBs).